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The Shenzhen Stock Exchange issued an announcement regarding adjustments to the list of securities eligible for the Hong Kong Stock Connect program.

2026-07-10

The Shenzhen Stock Exchange issued an announcement regarding adjustments to the list of securities eligible for the Hong Kong Stock Connect program.

Other News
2026-07-10

SK chairman Chey Tae-won said he plans to make "larger-scale" investments in the United States.

SK chairman Chey Tae-won said he plans to make "larger-scale" investments in the United States.
2026-07-10

1. Lutnick urges SK Hynix and Samsung to expand their US memory chip production capacity. 2. SK Hynix's US IPO was priced at $149, raising $26.5 billion. 3. Samsung and SK Hynix have postponed the application of hybrid bonding packaging technology

1. Lutnick urges SK Hynix and Samsung to expand their US memory chip production capacity. 2. SK Hynix's US IPO was priced at $149, raising $26.5 billion. 3. Samsung and SK Hynix have postponed the application of hybrid bonding packaging technology due to a significant decrease in industry urgency. 4. Micron plans to increase its US investment to over $250 billion by 2035. 5. Dan Bin: The listings of Changxin and Hynix are a major positive, and the A-share market has the potential to create trillion-dollar hard technology leaders. 6. TrendForce: Server DRAM contract prices are expected to increase by 13%-18% quarter-on-quarter in the third quarter. 7. Reports indicate that Nvidia's Rosa CPU uses TSMC's A16 process and features rear-mounted power supply technology. 8. Memory and other components continue to rise in price, with mainstream business laptops seeing price increases of over 1,000 yuan this year. 9. GigaDevice: Net profit for the first half of 2026 is expected to increase by 1099% year-on-year, with both volume and price of memory chip products rising. 10. Bank of America: Comet's revenue and profit margin are expected to rise, boosted by memory chip capacity expansion. 11. Peng Li, co-founder of Muxi: Domestic AI companies and products are far from sufficient; a balance needs to be found between computing power, storage, and interconnectivity. 12. Institution: Global semiconductor device industry revenue may approach $2 trillion as early as 2027.
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