Key News 1. Federal Reserve Chairman Warsh: The Fed will not tolerate excessive inflation. 2. New York State will temporarily ban the construction of new large data centers. 3. The US June unadjusted CPI year-on-year rate was 3.5% (previous value

2026-07-14

Key News 1. Federal Reserve Chairman Warsh: The Fed will not tolerate excessive inflation. 2. New York State will temporarily ban the construction of new large data centers. 3. The US June unadjusted CPI year-on-year rate was 3.5% (previous value 4.2%), exceeding market expectations of 3.8%; the US June seasonally adjusted CPI month-on-month rate was -0.4%, the largest drop since April 2020. 4. The US June unadjusted core CPI year-on-year rate was 2.6%, exceeding market expectations of 2.8%; the US June unadjusted core CPI month-on-month rate was 0%, the smallest increase since January 2021, exceeding market expectations of 0.2%. Stock News 1. SpaceX (SPCX.O): Successfully deployed 27 Starlink satellites. 2. According to market news, Nvidia (NVDA.O) has halved its list of Asian buyers. 3. Samsung Electronics: Currently not considering the possibility of issuing American Depositary Receipts. 4. IBM (IBM.N) shares fell over 20% pre-market after preliminary Q2 revenue missed expectations. 5. Citigroup (C.N) reported Q2 revenue growth of 14% to $24.8 billion, exceeding market expectations. 6. Nvidia (NVDA.O) will collaborate with Mitsubishi Heavy Industries in AI data center technology. 7. Miniso (MNSO.N) reported monthly sales exceeding 100 million yuan for its original IP "YOYO" product line. 8. JPMorgan Chase (JPM.N) reported Q2 net profit growth of 41.2% to $21.16 billion. 9. Bank of America (BAC.N) reported Q2 total revenue of $31.6 billion, a 15% year-over-year increase. 10. Goldman Sachs (GS.N) reported Q2 net profit surged nearly 80% year-over-year to $6.6 billion, marking the bank's best quarterly performance in five years. 11. Tower Semiconductor (TSEM.US) launched a dual-track expansion strategy in Japan: a comprehensive upgrade of its 300mm silicon photonics, silicon germanium processes, and advanced packaging capacity.