Samsung Electronics and Broadcom have signed a memorandum of understanding covering collaboration in memory chips, foundry services, and advanced packaging up to $200 billion by 2030. Samsung Electronics will partner with Broadcom to develop Broadcom

2026-07-25

Samsung Electronics and Broadcom have signed a memorandum of understanding covering collaboration in memory chips, foundry services, and advanced packaging up to $200 billion by 2030. Samsung Electronics will partner with Broadcom to develop Broadcom's next-generation AI accelerator based on Samsung's HBM technology. Samsung Electronics will provide sub-2nm foundry processes and advanced packaging solutions.