Samsung Electronics and Broadcom signed a memorandum of understanding to cooperate through 2030 on memory chips, foundry services and advanced packaging, with potential deal value up to $200 billion. Samsung will work with Broadcom to develop Broadco

2026-07-25

Samsung Electronics and Broadcom signed a memorandum of understanding to cooperate through 2030 on memory chips, foundry services and advanced packaging, with potential deal value up to $200 billion. Samsung will work with Broadcom to develop Broadcom’s next-generation AI accelerators using Samsung HBM technology and will provide sub-2nm foundry process capabilities and advanced packaging solutions.