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U.S. Trade Representative Greer said tariff rates are similar to previous levels.

2026-07-28

U.S. Trade Representative Greer said tariff rates are similar to previous levels.

Other News
2026-07-27

China Central Depository & Clearing Co. (CCDC) announced fee reductions for multiple core services and a full waiver of issuance registration fees for international (Panda) bonds. The interest/payment settlement fee for outstanding interbank market b

China Central Depository & Clearing Co. (CCDC) announced fee reductions for multiple core services and a full waiver of issuance registration fees for international (Panda) bonds. The interest/payment settlement fee for outstanding interbank market bonds are discounted to 95% of the current rate, resulting in 0.475 bps of face value. Interest/payment settlement fees for Sci-Tech innovation bonds and Panda bonds are fully waived. Spot bond settlement fees for bond types and issuers not covered by existing concessions will be cut 10% to 135 yuan/transaction. Settlement fees for pledged repos, buyout repos and bond lending in the interbank market are reduced to 95%: pledged repo single-security 114 yuan/tx, pledged repo multi-security 190 yuan/tx; buyout repo 190 yuan/tx; bond lending (including cross-custodian and centralized lending) 190 yuan/tx. OTC bond transaction settlement fees are cut to 95%, set at 0.19 bps of face value with a per-transaction cap of 120 yuan. All measures take effect from Sept. 1, 2026 through Dec. 31, 2028.
2026-07-27

South Korea’s Ministry of Science and ICT said on the 27th it signed an MoU with AMD on the 23rd in San Francisco for AMD to establish an AI excellence center in South Korea and develop an open AI infrastructure ecosystem. The center will support tec

South Korea’s Ministry of Science and ICT said on the 27th it signed an MoU with AMD on the 23rd in San Francisco for AMD to establish an AI excellence center in South Korea and develop an open AI infrastructure ecosystem. The center will support technology collaboration among Korean firms, universities and research institutes, AI chip software development, compute validation and joint R&D, and will promote cooperation with domestic AI chip companies. The MoU includes plans to build heterogeneous AI compute infrastructure linking AMD CPUs and GPUs with Korean inference-focused AI chips (NPUs) and to create an open AI compute ecosystem covering memory, networking, servers and software.
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