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BMW CFO said Q2 core profit margin was 2.3%, including a 125bp tariff burden and 120bp from integration of China operations.

2026-07-30

BMW CFO said Q2 core profit margin was 2.3%, including a 125bp tariff burden and 120bp from integration of China operations.

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2026-07-30

The Hang Seng Index opened 67.91 points higher, or 0.26%, at 25,875.83 on Thursday, July 30. The Hang Seng Tech Index opened 21.03 points higher, or 0.43%, at 4,885.76. The H-share Index opened 50.67 points higher, or 0.59%, at 8,674.19. The Red Chip

The Hang Seng Index opened 67.91 points higher, or 0.26%, at 25,875.83 on Thursday, July 30. The Hang Seng Tech Index opened 21.03 points higher, or 0.43%, at 4,885.76. The H-share Index opened 50.67 points higher, or 0.59%, at 8,674.19. The Red Chip Index opened 11.2 points higher, or 0.26%, at 4,241.61.
2026-07-30

Tech giants are releasing their earnings reports one after another. Following Microsoft and Meta's reports early this morning, Apple and Amazon will release theirs early tomorrow morning. Nvidia's highly anticipated report won't be available until Au

Tech giants are releasing their earnings reports one after another. Following Microsoft and Meta's reports early this morning, Apple and Amazon will release theirs early tomorrow morning. Nvidia's highly anticipated report won't be available until August 26th. AI chip demand, data center revenue, gross margin, and subsequent guidance will validate the health of cloud computing, AI capital expenditure, advertising, and consumer electronics sectors. Besides earnings reports, several important conferences are worth noting. The Future of Memory & Storage Conference on August 4th will feature companies including Samsung, SK Hynix, Micron, and Nvidia, making it crucial for the storage industry chain. Hot Chips 2026, from August 23-25, is the most anticipated technical conference in the chip architecture and AI hardware fields. Nvidia's Vera CPU, HBM architecture, advanced packaging, and next-generation processors from several companies will be announced, potentially impacting expectations for the CPU, GPU, HBM, and packaging industry chains.
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