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German chancellor MERZ said the incident in Poland demonstrates Russia's recklessness and willingness to escalate.

2026-07-30

German chancellor MERZ said the incident in Poland demonstrates Russia's recklessness and willingness to escalate.

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2026-07-30

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.
2026-07-30

Japanese Prime Minister Sanae Takaichi will seek measures to allow Japan to adjust its consumption tax rate more flexibly.

Japanese Prime Minister Sanae Takaichi will seek measures to allow Japan to adjust its consumption tax rate more flexibly.
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