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Bank of Japan Governor Kazuo Ueda: There is an upside risk to the potential CPI, which may exceed the 2% price stability target.

2026-07-31

Bank of Japan Governor Kazuo Ueda: There is an upside risk to the potential CPI, which may exceed the 2% price stability target.

Other News
2026-07-30

Hungarian Prime Minister: Hungary's energy consumption may increase by 20% during the peak period from 5 pm to 10 pm.

Hungarian Prime Minister: Hungary's energy consumption may increase by 20% during the peak period from 5 pm to 10 pm.
2026-07-30

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more

The Information, citing two people familiar with the project, reports TSMC (TSM.N) is developing an advanced chip-packaging technology similar to Intel's (INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand to integrate more processors and high-bandwidth memory into larger multi-die packages, advanced packaging has emerged as a key industry bottleneck. Intel’s EMIB uses small silicon bridges to create high-speed links between processors and memory, enabling larger multi-chip AI designs and helping customers diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources say TSMC engineers internally call the work “EMIB-like” and have discussed the solution with some customers.
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