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SK Hynix shares tumbled 10%.

2026-08-06

SK Hynix shares tumbled 10%.

Other News
2026-08-06

Iran's deputy foreign minister said there have been no recent negotiations with the United States.

Iran's deputy foreign minister said there have been no recent negotiations with the United States.
2026-08-06

1. With expected increases in wafer fab capital expenditures, TSMC and major memory manufacturers are anticipated to face significant upward revisions in their capital expenditures. Meanwhile, second-tier foundries (such as UMC and Powerchip) and new

1. With expected increases in wafer fab capital expenditures, TSMC and major memory manufacturers are anticipated to face significant upward revisions in their capital expenditures. Meanwhile, second-tier foundries (such as UMC and Powerchip) and new competitors are actively expanding production to compete for market share. 2. Semiconductor equipment and cleanroom space (i.e., the space for installing semiconductor equipment) are expected to replace chips themselves in 2027-2028, becoming the industry's main capacity bottleneck in the next stage. 3. The increasing adoption of 2.5D packaging in CPUs and edge devices, coupled with the start of TSMC's 3D packaging investment cycle and the implementation of technologies such as CPO/NPO (co-packaged optics), will significantly drive strong demand for packaging and testing equipment. 4. Prioritize global and regional leaders: Tokyo Electron, Advantest, ASMPT, GPTC, Chroma, and Hon Precision. Furthermore, China's semiconductor ecosystem is accelerating the localization of equipment and technology, bringing continuous benefits to domestic equipment manufacturers. Companies such as Naura Technology Group, AMEC, and ACM Research are worth watching. (The above views are from a JPMorgan report dated August 5th.)
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