TSMC said its CoWoS advanced packaging for AI chips has achieved production
yields of 98–99% for some products. He Jun, VP of advanced packaging technology
and services, said the high yields mainly apply to CoWoS AI products using a
5.5x reticle size, which are now in mass production, and TSMC expects to scale
CoWoS to a 14x reticle size by 2029.
