Major customers have provided 2027 guidance and orders; demand for 1.6T and 800G
is expected to remain rapidly higher than in 2026. New products — 2.4T, NPO and
XPO — are being developed for scale-out and scale-up applications; company is
sampling to large-customer specs with target mass production in H2 2027 and
larger-scale shipments in 2028. Management is expanding capacity and preparing
core inputs (optical chips, electronic chips and PCBs) to support a 2027 volume
ramp.
