SK Hynix held a groundbreaking for an advanced memory packaging plant in
Lafayette, Indiana, investing more than $4.0 bln on a 133.5-acre site to build
its first U.S. high-bandwidth memory (HBM) packaging base. The company said the
plant cleanroom is expected to be operational by October 2028, with
next-generation HBM mass production targeted in H2 2029; full operations are
expected to employ about 1,000 staff.