TSMC VP of advanced packaging technology Xu Guojin said optical-transceiver architectures are undergoing a structural shift and silicon photonics have become the mainstream. He expects silicon photonics could exceed 50% market share by 2027, will ult

2026-08-31

TSMC VP of advanced packaging technology Xu Guojin said optical-transceiver architectures are undergoing a structural shift and silicon photonics have become the mainstream. He expects silicon photonics could exceed 50% market share by 2027, will ultimately take the form of co-packaged optics (CPO), and some Vendors will begin volume production in H2 this year.