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Indian oil company executives: Plans to increase domestic natural gas sales by 1.5 times by 2030.

2026-08-31

Indian oil company executives: Plans to increase domestic natural gas sales by 1.5 times by 2030.

Other News
2026-08-31

Pakistan's Ministry of Foreign Affairs: Foreign Minister and Defense Minister Asif and Army Chief of Staff Asim Munir will represent Pakistan at the Mecca Council meeting.

Pakistan's Ministry of Foreign Affairs: Foreign Minister and Defense Minister Asif and Army Chief of Staff Asim Munir will represent Pakistan at the Mecca Council meeting.
2026-08-31

SK Hynix is considering partially outsourcing the production of its base chips, previously entirely to TSMC, to Intel to diversify its supplier base: 1. Starting with HBM4E, the company will introduce Intel to manufacture some of its HBM base dies,

SK Hynix is considering partially outsourcing the production of its base chips, previously entirely to TSMC, to Intel to diversify its supplier base: 1. Starting with HBM4E, the company will introduce Intel to manufacture some of its HBM base dies, forming a dual-supplier system with TSMC. This aims to reduce reliance on TSMC and enhance its cost and price negotiation capabilities. 2. The HBM base die is the lowest-level "master control chip," responsible for managing upper-layer memory and providing high-speed connections to GPUs/CPUs. 3. Industry estimates suggest that the cost of an HBM4 base die is approximately 3-4 times that of an upper-layer DRAM core die, and the cost of HBM4E may increase further. Furthermore, HBM heavily relies on long-term supply agreements, making it difficult to pass on increased manufacturing costs to customers in a timely manner. 4. If Intel joins the supply chain, SK Hynix can simultaneously improve its cost competitiveness and supply stability. As HBM4 enters the era of "customized HBM," base dies need to be customized for different AI accelerators, further increasing the importance of supply chain diversification. The collaboration between the two parties may extend to advanced packaging in the future, with SK Hynix already evaluating TSMC's CoWoS and Intel's EMIB solutions.
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