BYD Semiconductor launches a next‑generation automotive‑grade 4D millimeter‑wave radar chip using a satellite architecture centered on the Xuanji A3 compute module. The in‑house chip provides a MIPI CSI‑2 high‑speed interface and broad compatibility

2026-09-01

BYD Semiconductor launches a next‑generation automotive‑grade 4D millimeter‑wave radar chip using a satellite architecture centered on the Xuanji A3 compute module. The in‑house chip provides a MIPI CSI‑2 high‑speed interface and broad compatibility with mainstream SerDes links for seamless integration with major automated‑driving chip platforms. It has completed joint tuning with the Xuanji A3 driving chip and meets Tier‑1 module makers’ detection‑performance requirements. Fabricated on a mature 28nm automotive process, the chip targets demand for high‑resolution radar systems in the automotive market.