BYD Semiconductor launches a next‑generation automotive‑grade 4D millimeter‑wave
radar chip using a satellite architecture centered on the Xuanji A3 compute
module. The in‑house chip provides a MIPI CSI‑2 high‑speed interface and broad
compatibility with mainstream SerDes links for seamless integration with major
automated‑driving chip platforms. It has completed joint tuning with the Xuanji
A3 driving chip and meets Tier‑1 module makers’ detection‑performance
requirements. Fabricated on a mature 28nm automotive process, the chip targets
demand for high‑resolution radar systems in the automotive market.