1. Montage Technology: CXL3.2 chip to be adopted by Samsung and SK Hynix; PCIe Switch expected to tap out this year.
2. Changcun Holdings' IPO application status on the Science and Technology Innovation Board changes to "under inquiry".
3. Institutions: Memory costs are rising; iPhone 18 series pricing is expected to increase by 10%-20%.
4. Korea Electric Power plans to collect 25 trillion won in advance from Samsung and SK Hynix for electricity fees to fund semiconductor grid construction.
5. Reports indicate Micron is exploring the development of near-GPU NAND flash memory to run larger LLMs.
6. Samsung will add 1,612 pieces of equipment to its chip factory in Vietnam.
7. Institutions: Samsung's HBM market share surged in the second quarter of this year, narrowing the gap with SK Hynix.
8. ByteDance's new generation of Doubao phones uses Changxin Technology's LPDDR5X memory.
9. JCET Group: Plans to raise no more than 6.5 billion yuan through a private placement for high-performance computing advanced packaging platform expansion projects, etc. 10. Supply and demand for driver ICs for small-to-medium-sized LCD displays is relatively tight.
11. A Chinese team has achieved a new breakthrough in its independently developed superconducting quantum computer, achieving a transmission efficiency of up to 98%.
