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Benchuan convertible bonds in the A-share market continued to rise in the afternoon, currently up 11.55% to 195.885 yuan per bond, while the underlying stock, Benchuan Intelligent, rose 7.2%.

2026-09-07

Benchuan convertible bonds in the A-share market continued to rise in the afternoon, currently up 11.55% to 195.885 yuan per bond, while the underlying stock, Benchuan Intelligent, rose 7.2%.

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2026-09-07

FAA says a cargo aircraft slid off the runway at Miami airport after landing.

FAA says a cargo aircraft slid off the runway at Miami airport after landing.
2026-09-07

1. Nvidia GPU rental prices mostly increased. 2. HGTECH: HGTECH's 100G SFP112 optical module will be showcased at CIOE 2026. 3. Samsung Electronics collaborates with Arm to develop next-generation edge AI chips. 4. Institution: Global DRAM market

1. Nvidia GPU rental prices mostly increased. 2. HGTECH: HGTECH's 100G SFP112 optical module will be showcased at CIOE 2026. 3. Samsung Electronics collaborates with Arm to develop next-generation edge AI chips. 4. Institution: Global DRAM market revenue is expected to increase by 385% year-on-year in Q2 2026. 5. SK Hynix accelerates its 1c DRAM transformation, leading the HBM4E competition in South Korea. 6. Phison: NAND Flash supply will remain tight next year; AI-driven semiconductor demand is just beginning. 7. Rising memory prices push up smartphone costs; the average price of smartphones sold globally is expected to increase by about 15% in 2026. 8. Institution: Improved CPU supply; global notebook shipments are expected to see a narrowing of the year-on-year decline to 9.4% in 2026. 9. Kioxia plans to promote NAND flash memory to replace some DRAM. 10. Bank of Korea: South Korea's memory chip production capacity advantage is expected to further expand. 11. Seven departments: Strengthen R&D of key supporting technologies such as in-memory computing, high-performance storage, data compression, distributed training frameworks, and DB4AI (database serving AI). 12. Micron plans to make large-scale equipment investments before the end of the year to enhance the supply capacity of its latest generation HBM—HBM4 12-layer products.
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