ASML said it will work with key customers to develop new solutions for equipment
capable of producing the most advanced chips to meet demand from designers of
large data-center processors such as NVIDIA. Current widely used
extreme-ultraviolet (EUV) scanners can manufacture dies up to about 800 mm2.
ASML's next-generation high-numerical-aperture (High-NA) EUV machines deliver
finer resolution but are constrained in maximum die area by smaller reticles.
ASML plans to demonstrate a pilot line using larger reticles by 2031 and to have
the technology ready for high-volume production by 2033.
