Samsung Electronics said it has opened an advanced semiconductor packaging R&D center in Yokohama, Japan. The company plans to invest about 40 bln yen over five years from 2024 to expand lab hardware and bolster advanced packaging capabilities, and w

2026-09-08

Samsung Electronics said it has opened an advanced semiconductor packaging R&D center in Yokohama, Japan. The company plans to invest about 40 bln yen over five years from 2024 to expand lab hardware and bolster advanced packaging capabilities, and will collaborate with Japanese firms, universities and research institutes to develop next‑generation packaging materials and processes. Samsung targets more than 100 researchers at the facility by 2027.