Yangtze Memory Technologies (YMTC), China’s largest NAND flash maker, has begun
connecting production equipment at its Wuhan third wafer fab (FAB3), and
preliminary operations could start before year-end as commissioning enters final
stages. State contractor China Electronics Corporation (CEC) subsidiary China
Electronics System Engineering Second Construction Co. has started selecting
builders for the “gas” segment of the FAB3 secondary piping A‑zone B‑package
project; the secondary piping work links plant utilities (gas, water, etc.) to
individual production tools, a step toward full tool readiness. The tender
requires bidders to have YMTC, CXMT or equivalent 12‑inch fab construction
experience. Market takeaway: the new capacity is unlikely to trigger near‑term
NAND oversupply, but expanding domestic output and share could heighten
competition for incumbent NAND vendors over the medium term.
