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TrendForce says as GPU vendors and hyperscale cloud providers develop more Powerful, feature-rich AI chips, 2.5D packaging development is focusing on larger package area. TSMC’s CoWoS-L faces competition from Intel’s EMIB-T but, due to greater maturi

2026-09-18

TrendForce says as GPU vendors and hyperscale cloud providers develop more Powerful, feature-rich AI chips, 2.5D packaging development is focusing on larger package area. TSMC’s CoWoS-L faces competition from Intel’s EMIB-T but, due to greater maturity and yield advantages, is expected to remain the mainstream AI chip packaging solution through 2028.

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2026-09-18

Hong Kong-listed AI stocks fluctuated higher, with MINIMAX-W (00100.HK) rising over 9% and Zhipu (02513.HK) rising over 3%.

Hong Kong-listed AI stocks fluctuated higher, with MINIMAX-W (00100.HK) rising over 9% and Zhipu (02513.HK) rising over 3%.
2026-09-18

Foreign central banks' holdings of US Treasures rose $18.726 billion in the week to Sept. 11, versus a $11.146 billion decline the previous week.

Foreign central banks' holdings of US Treasures rose $18.726 billion in the week to Sept. 11, versus a $11.146 billion decline the previous week.
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