Xiandao Technology Group’s Xiandao Xinguang Optoelectronics Technology (Wuhan)
Co. has commissioned its wafer fab in the East Lake Comprehensive Bonded Zone in
Wuhan’s Optics Valley. The facility is the manufacturing core of a 12.0 bln yuan
high-end III‑V compound semiconductor materials and chip industrialization base,
with 4‑ and 6‑inch indium phosphide and 6‑ and 8‑inch gallium arsenide
large‑wafer optoelectronic chip platforms. With line commissioning complete, the
site moves from construction into process qualification and product
introduction.
