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Federal Reserve's Hammarck: Businesses are passing on higher input costs to consumers.

2026-10-13

Federal Reserve's Hammarck: Businesses are passing on higher input costs to consumers.

Other News
2026-10-12

Hong Kong stocks closed mixed after an intraday high above 1% for the HSI. The Hang Seng Index (HSI) ended up 0.25%; the Hang Seng Tech Index fell 0.67%. Mainland bank names were bid—China Merchants Bank (03968.HK) rose over 3%. Stablecoin-themed and

Hong Kong stocks closed mixed after an intraday high above 1% for the HSI. The Hang Seng Index (HSI) ended up 0.25%; the Hang Seng Tech Index fell 0.67%. Mainland bank names were bid—China Merchants Bank (03968.HK) rose over 3%. Stablecoin-themed and biotech names saw gains—01328.HK and 02696.HK each climbed more than 3%. Outperforming sectors included power, Chinese brokerages, marquee internet, lithium batteries and AI. Optical-communications shares extended losses—Cambridge Technology (06166.HK) tumbled over 11% and 06869.HK fell more than 7%. PCB names underperformed—03200.HK dropped over 9%. Chips, mainland property, new-consumption and NEV sectors were also weaker.
2026-10-12

Pure copper has a thermal conductivity of approximately 400 W/m·K, while the copper/diamond composite material showcased at the Taiwan Semiconductor Show reaches approximately 800 W/m·K, which helps to dissipate heat more quickly and reduce localized

Pure copper has a thermal conductivity of approximately 400 W/m·K, while the copper/diamond composite material showcased at the Taiwan Semiconductor Show reaches approximately 800 W/m·K, which helps to dissipate heat more quickly and reduce localized hot spots. They also reduce warpage: silicon has a thermal expansion coefficient of approximately 3 ppm/K, copper approximately 17 ppm/K, while copper/diamond can be tuned to closer to 6–10 ppm/K. Currently, only ElementSix (a De Beers subsidiary) publicly offers copper/diamond composite materials with a conductivity in the 800 W/m·K range. ElementSix, launching in January 2025, focuses on AI/HPC and 2.5/3D advanced packaging. A key challenge with this material lies in the copper/diamond interface. Copper and diamond naturally do not bond well, so titanium, chromium, molybdenum, or tungsten are often added to form a carbide bonding layer. However, too much carbide can impair thermal conductivity, making interface thickness control crucial. Compared to simple copper alloying, the industry is using physical vapor deposition or chemical vapor deposition to pre-coat diamond particles for more precise control.
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