Huawei semiconductor EDA chief scientist Huang Yu told the 2026 Bay Chip Expo
that Huawei's 'Tao's Law' is structured in four layers: device (optimize
transistor structures and interconnects to compress device time constants); link
(the firm's main innovation); chip (hardware-software co-design to enable new
architectures); and system (supernodes and cabinet interconnects that need
faster links and better protocols). He said the primary bottleneck is EDA tools;
process, engineering and system-design challenges also remain.
