1. Industry forecast: Yangtze Memory Technologies (YMTC) will jump to third place globally in NAND shipments in Q2 2026.
2. SK Hynix launches 3D FeNAND technology.
3. Reports indicate an explosion and fire at Intel's advanced wafer fab in Israel.
4. Samsung Electronics reportedly plans to apply its 4F² technology to 3D DRAM.
5. Jiangbolong: Net profit for the first three quarters is expected to increase by 1865%-1991% year-on-year, with the marginal contribution of rising memory prices to profitability slowing significantly.
6. Surge in AI chip demand drove TSMC's Q3 net profit up 69%, a record high and exceeding expectations.
7. TSMC confirmed it is in talks with Musk about a collaboration on the Terafab chip factory, but insists on maintaining control over production operations.
8. Industry analysis: Soaring memory prices are squeezing the costs of other components, leading to screen downgrades in smartphones.
9. Hana Asset Management: The AI boom will spread beyond semiconductors, with capacitor and AI substrate companies expected to benefit. 10. A microcosm of global memory price increases: The price of a 32GB DDR5 kit has increased by approximately 434.2% in 13 months, rivaling or even exceeding that of flagship CPUs.
11. UBI Research: Soaring memory prices squeeze the costs of other components, forcing smartphones to face screen downgrades.
