Sanfu Xinke unit Mingyi Electronics has launched a new high-aspect-ratio
gantry-line plating system supporting 40:1 and higher board aspect ratios. The
platform is customer-customizable and compatible with phosphor-copper ball and
insoluble-anode systems, targeting high-aspect-ratio AI server PCBs and IC
substrate plating. The equipment has passed technical tests and won approval
from a leading domestic server PCB maker; multiple orders are on hand and
production and delivery have begun.
