The STAR Market 50 Index fell by more than 2%, with Ninebot falling by more than 6% and Amlogic falling by more than 5% among its constituent stocks.

Yuanta Securities Investment Consulting points out that as optical communication transmission enters the 1.6T and 3.2T era, the demand for related material upgrades continues to grow, making ABF substrates, copper-clad laminates, and fiberglass cloth areas worthy of attention. Especially driven by the rising demand for AI GPUs, ASICs, and high-performance computing (HPC), the shipment prices and volumes of high-end substrates are rising simultaneously, and the overall capacity utilization rate of ABF substrates, BT substrates, and high-density interconnect (HDI) boards is expected to remain high. The institution predicts that related products are expected to see price increases of 10% to 15% per quarter starting in the second half of this year. Unified Securities Investment Consulting also stated that upstream material shortages are driving a new round of price increases, and the upward pressure has already been transmitted to the copper-clad laminate sector, with an expected increase of approximately 10% to 15%, and the relevant price adjustments will officially take effect in November. Among them, the supply of thin fiberglass cloth models such as 2116, 1080, and 1078 is tight in the short term due to the limited expansion of weaving equipment. The institution recommends continuing to focus on long-term investment opportunities in the PCB industry chain. From the perspective of packaging technology upgrades, South China Investment Consulting stated that as AI chips develop towards larger-size packaging, IC substrate sizes have further increased from 100mm×100mm to 150mm×150mm; the number of PCB layers has also increased from 30-40 layers to over 70 layers, driving a continuous increase in product added value. The agency predicts that the total output value of the substrate industry will increase by approximately 40% this year, while the growth rate in the HDI and high-multilayer board sectors is expected to reach 32%.

1. OpenAI announced three scientific breakthroughs in AI, involving mathematical conjectures, computer algorithms, and the Millennium Prize Problem. 2. Anthropic filed for an IPO on Nasdaq under the ticker symbol "ANT". 3. Meta plans to raise up to $95 billion through equity financing, with Nvidia, AMD, and others interested in subscribing for up to $5 billion. 4. Microsoft launched a voluntary departure program as it invests in AI, with approximately 60,000 employees eligible. 5. Google, Amazon, and Broadcom provided $77 billion in funding to Anthropic. 6. Anthropic warned that its computing power expansion will continue to consume significant amounts of cash, and capital expenditures may increase significantly. 7. SpaceX signed a $40 billion GPU financing agreement with Apollo. 8. The Netherlands plans to cut 25,000 civil service jobs through AI reforms. 9. OpenAI launched GPT-6.1 Terra, increasing computer operating speed by more than 3 times and reducing API prices by 50%. 10. DeepSeek's new model topped the global charts in weekly usage, surging 801% week-on-week. 11. my country successfully completed a 3.2Pb/s (petbits per second) multi-core optical fiber real-time bidirectional transmission test, capable of downloading over 20,000 4K movies per second. 12. National Bureau of Statistics: From January to September, computing power and data center construction drove profit growth of the optical fiber manufacturing and optical cable manufacturing industries by 5.7 times and 1.1 times respectively. 13. Zhiyuan released the safety-grade heavy-duty android robot, Elf G2 Max, already in production, demonstrating its capabilities in robot-made robots. 14. Unitree Robotics: The humanoid robot industry is still in its early stages of commercialization; the large-scale deployment of physical AI technology from laboratory demonstrations to real-world scenarios still faces multiple challenges.