At its 2026 Xinhe user ecosystem conference, Xinhe Semiconductor unveiled Agent
Evo, an agentic AI platform for chip- and system-level engineering
orchestration. The platform includes built-in agents for advanced packaging,
packaging and PCB workflows, and multi-physics coupling. Xinhe’s VP of R&D Jiang
Liguo said the time-compression-driven, coordinated architecture optimization
could boost design iteration speed fourfold and cut manual operations by about
80%.