Shenzhen Nan Circuit: The company's FC-BGA packaging substrate currently has the capacity for mass production of products with 20 layers or less, with a minimum line width and line spacing of 9/12μm.
2025-05-23
Shenzhen Nan Circuit: The company's FC-BGA packaging substrate currently has the capacity for mass production of products with 20 layers or less, with a minimum line width and line spacing of 9/12μm.