Hanmi Semiconductor: Hybrid bonders for high-bandwidth memory (HBM) are expected to be available in 2027, and hybrid bonders for system-on-chip (SoC) are expected to be available in 2028.
2025-09-18
Hanmi Semiconductor: Hybrid bonders for high-bandwidth memory (HBM) are expected to be available in 2027, and hybrid bonders for system-on-chip (SoC) are expected to be available in 2028.