Hanmi Semiconductor: Hybrid bonders for high-bandwidth memory (HBM) are expected to be available in 2027, and hybrid bonders for system-on-chip (SoC) are expected to be available in 2028.

2025-09-18

Hanmi Semiconductor: Hybrid bonders for high-bandwidth memory (HBM) are expected to be available in 2027, and hybrid bonders for system-on-chip (SoC) are expected to be available in 2028.