June 5 — Pulin Technology said it and Shenzhen Lice used a vacuum air‑pressure
wafer‑level nanoimprint (PL‑AS) plus a custom dual‑layer imprint resist and core
process to achieve scalable 8‑inch photonic‑chip wafer production, fully
bypassing deep‑UV (DUV) lithography and reducing chip manufacturing cost to
one‑tenth of comparable DUV routes. A‑share nanoimprint‑related names cited
include Suda Weige, Medikai, Lihexing, Jingfang Technology, Jinghua Laser and
Crystal Optoelectronics.
