June 5 — Pulin Technology said it and Shenzhen Lice used a vacuum air‑pressure wafer‑level nanoimprint (PL‑AS) plus a custom dual‑layer imprint resist and core process to achieve scalable 8‑inch photonic‑chip wafer production, fully bypassing deep‑UV (DUV) lithography and reducing chip manufacturing cost to one‑tenth of comparable DUV routes. A‑share nanoimprint‑related names cited include Suda Weige, Medikai, Lihexing, Jingfang Technology, Jinghua Laser and Crystal Optoelectronics.

An ECB Governing Council member and Cyprus central bank governor said on Sunday Europe should drop long-standing political resistance to joint debt issuance and create a large-scale common “safe asset” to strengthen EU sovereignty and stability. He argued the rare synchronicity of economic, geopolitical and institutional conditions strengthens the case for pooled bonds. A common instrument, he said, could lower borrowing costs, reduce market fragmentation and finance large-scale green, digital and AI investments, defence, public-health preparedness and energy-security projects. He acknowledged Germany and the Netherlands’ historical opposition over contingent taxpayer liability, and said the ECB is increasingly pushing the policy shift.

U.S.-drafted IAEA Board of Governors resolution emphasizes that Iran's NPT safeguards agreement cannot be unilaterally modified or suspended.