Dongfang Suanxin unveiled its flagship DF1000 in Shanghai, presenting it as the world’s first software‑defined 3D-stacked near‑memory compute chip. The DF1000 uses software‑defined chip technology to decouple hardware and software and enable dynamic reconfiguration, and adopts 3D near‑memory stacking. Built on a 14nm node, the company reports the chip achieves 520 TFLOPS at BF16 and is targeted at addressing core bottlenecks in China’s high‑end compute chip development.