Dongfang Suanxin unveiled its flagship DF1000 in Shanghai, presenting it as the
world’s first software‑defined 3D-stacked near‑memory compute chip. The DF1000
uses software‑defined chip technology to decouple hardware and software and
enable dynamic reconfiguration, and adopts 3D near‑memory stacking. Built on a
14nm node, the company reports the chip achieves 520 TFLOPS at BF16 and is
targeted at addressing core bottlenecks in China’s high‑end compute chip
development.