CITIC Securities research says advanced packaging will be a key route to sustaining steep performance upgrades for high-end chips. Glass substrates are expected to address current advanced-packaging bottlenecks — large-format scaling, higher-density/high-speed integration and yield/throughput — and are likely to enter an accelerated maturity and volume-ramp phase. Glass carrier-board penetration is clear and has high growth elasticity; the firm highlights supply-chain investment opportunities, n

CITIC Securities research says advanced packaging will be a key route to sustaining steep performance upgrades for high-end chips. Glass substrates are expected to address current advanced-packaging bottlenecks — large-format scaling, higher-density/high-speed integration and yield/throughput — and are likely to enter an accelerated maturity and volume-ramp phase. Glass carrier-board penetration is clear and has high growth elasticity; the firm highlights supply-chain investment opportunities, notably in glass interposers, glass carriers and glass bridges.