CITIC Securities research says advanced packaging will be a key route to
sustaining steep performance upgrades for high-end chips. Glass substrates are
expected to address current advanced-packaging bottlenecks — large-format
scaling, higher-density/high-speed integration and yield/throughput — and are
likely to enter an accelerated maturity and volume-ramp phase. Glass
carrier-board penetration is clear and has high growth elasticity; the firm
highlights supply-chain investment opportunities, notably in glass interposers,
glass carriers and glass bridges.
