Reportedly TSMC’s advanced-packaging CoWoS capacity is oversubscribed and orders are fully booked. Some back-end advanced-packaging orders have spilled to an Intel-owned Malaysia plant under partial capacity-sharing to serve common major customers, breaking prior ecosystem norms. Market participants say the overflow should free front-end advanced-node capacity and accelerate TSMC node shipments. Suppliers overlapping both players’ chains — including ASE Technology Holding, substrate leader Unimi

Reportedly TSMC’s advanced-packaging CoWoS capacity is oversubscribed and orders are fully booked. Some back-end advanced-packaging orders have spilled to an Intel-owned Malaysia plant under partial capacity-sharing to serve common major customers, breaking prior ecosystem norms. Market participants say the overflow should free front-end advanced-node capacity and accelerate TSMC node shipments. Suppliers overlapping both players’ chains — including ASE Technology Holding, substrate leader Unimicron Technology and other packaging groups — are expected to benefit. Industry sources on Aug. 18 said the global advanced-packaging bottleneck is that back-end ramp rates lag front-end output; more back-end suppliers joining capacity would help speed front-end deliveries.