Reportedly TSMC’s advanced-packaging CoWoS capacity is oversubscribed and orders
are fully booked. Some back-end advanced-packaging orders have spilled to an
Intel-owned Malaysia plant under partial capacity-sharing to serve common major
customers, breaking prior ecosystem norms. Market participants say the overflow
should free front-end advanced-node capacity and accelerate TSMC node shipments.
Suppliers overlapping both players’ chains — including ASE Technology Holding,
substrate leader Unimicron Technology and other packaging groups — are expected
to benefit. Industry sources on Aug. 18 said the global advanced-packaging
bottleneck is that back-end ramp rates lag front-end output; more back-end
suppliers joining capacity would help speed front-end deliveries.
