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【机构:下半年中国线路板产业投资将呈现三大趋势】CINNO•IC Research最新研究显示,2026年下半年,中国线路板产业投资将呈现高端深化、区域协同、绿色加速三大趋势:高端化持续聚焦AI算力PCB,加码高阶HDI、超高多层板及先进封装载板研发,缩小国际差距,巩固AI、车载高端PCB优势,稳步向PCB产业强国跨越;区域布局分工优化,东部主攻高端研发、中西部承接配套制造,协同增效;同时加强绿色制造投入提升,环保材料与节能工艺加速落地。
2026-08-27
【机构:下半年中国线路板产业投资将呈现三大趋势】CINNO•IC Research最新研究显示,2026年下半年,中国线路板产业投资将呈现高端深化、区域协同、绿色加速三大趋势:高端化持续聚焦AI算力PCB,加码高阶HDI、超高多层板及先进封装载板研发,缩小国际差距,巩固AI、车载高端PCB优势,稳步向PCB产业强国跨越;区域布局分工优化,东部主攻高端研发、中西部承接配套制造,协同增效;同时加强绿色制造投入提升,环保材料与节能工艺加速落地。
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2026-08-27
Fujian provincial government issued a '15th Five-Year' plan for emerging and future industries, targeting Xiamen, Quanzhou, Fuzhou and Putian to build chip design, specialty-process fabs, packaging & testing and component/equipment supply chains. The plan calls for R&D of high-performance AI system-on-chip (SoC), autonomous-driving and industrial-control chips and seeks active integration into the national AI chip layout; it directs steady expansion of 12-inch wafer, power semiconductor and anal
Fujian provincial government issued a '15th Five-Year' plan for emerging and future industries, targeting Xiamen, Quanzhou, Fuzhou and Putian to build chip design, specialty-process fabs, packaging & testing and component/equipment supply chains. The plan calls for R&D of high-performance AI system-on-chip (SoC), autonomous-driving and industrial-control chips and seeks active integration into the national AI chip layout; it directs steady expansion of 12-inch wafer, power semiconductor and analog chip capacity, promotes scaled and specialized development of packaging & testing across advanced and traditional nodes, and upgrades packaging substrates, photoresist development equipment and other supporting capabilities.
2026-08-27
India's Bharat Petroleum (BPCL) executives said the company will build a petrochemical unit and an ethylene cracker at its Bina refinery.
India's Bharat Petroleum (BPCL) executives said the company will build a petrochemical unit and an ethylene cracker at its Bina refinery.
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