[Institution: Three Major Trends in China's PCB Industry Investment in the Second Half of the Year] A recent study by CINNO•IC Research indicates that in the second half of 2026, investment in China's PCB industry will exhibit three major trends: high-end deepening, regional collaboration, and green acceleration. High-end development will continue to focus on AI computing power PCBs, increasing investment in high-end HDI, ultra-high-performance multilayer boards, and advanced packaging substrates to narrow the international gap, consolidate advantages in AI and automotive high-end PCBs, and steadily move towards becoming a leading PCB manufacturing nation. Regional layout and division of labor will be optimized, with the eastern region focusing on high-end R&D and the central and western regions undertaking supporting manufacturing, resulting in synergistic efficiency. Simultaneously, investment in green manufacturing will be strengthened, and environmentally friendly materials and energy-saving processes will be implemented more rapidly.
