Sources say TSMC's CoWoS orders are booked through 2027, with some customers facing waits of more than a year. The supply bottleneck is increasing interest in Intel's EMIB-T packaging as an alternative. MediaTek told investors on its recent earnings call it plans to deploy both CoWoS and EMIB-T at scale for AI ASIC development; Broadcom and Meta are reportedly weighing a move from CoWoS to EMIB to reduce costs, and Google and NVIDIA have also expressed interest in EMIB-T.