Sources say TSMC's CoWoS orders are booked through 2027, with some customers
facing waits of more than a year. The supply bottleneck is increasing interest
in Intel's EMIB-T packaging as an alternative. MediaTek told investors on its
recent earnings call it plans to deploy both CoWoS and EMIB-T at scale for AI
ASIC development; Broadcom and Meta are reportedly weighing a move from CoWoS to
EMIB to reduce costs, and Google and NVIDIA have also expressed interest in
EMIB-T.
