At a 2026 Kirin media briefing, Huawei Semiconductor wireless terminal chip product head Xu Songyu released the detailed architecture for the Kirin 9050 Pro, listing a new-generation Lingxi CPU, Maliang GPU, Da Vinci-architecture NPU, Kirin AI ISP, Balong AI modem, FFTS function-flow task scheduler, audio/video processor, security processor and Lingxi microkernel coordination. Xu said the next-generation Kirin 2027 chip is already ready and that all test results to date meet expectations, suppor

At a 2026 Kirin media briefing, Huawei Semiconductor wireless terminal chip product head Xu Songyu released the detailed architecture for the Kirin 9050 Pro, listing a new-generation Lingxi CPU, Maliang GPU, Da Vinci-architecture NPU, Kirin AI ISP, Balong AI modem, FFTS function-flow task scheduler, audio/video processor, security processor and Lingxi microkernel coordination. Xu said the next-generation Kirin 2027 chip is already ready and that all test results to date meet expectations, supporting a sustainable evolution over the next 10 years (logical folding). He added that specific stage-by-stage technology choices will be developed and discussed progressively.