At a 2026 Kirin media briefing, Huawei Semiconductor wireless terminal chip
product head Xu Songyu released the detailed architecture for the Kirin 9050
Pro, listing a new-generation Lingxi CPU, Maliang GPU, Da Vinci-architecture
NPU, Kirin AI ISP, Balong AI modem, FFTS function-flow task scheduler,
audio/video processor, security processor and Lingxi microkernel coordination.
Xu said the next-generation Kirin 2027 chip is already ready and that all test
results to date meet expectations, supporting a sustainable evolution over the
next 10 years (logical folding). He added that specific stage-by-stage
technology choices will be developed and discussed progressively.
