TrendForce’s AI Infra research forecasts the global AI Networking & Interconnect market will expand from $37.9 bln in 2024 to $279.8 bln in 2027, a 2024–27 CAGR of 95%, driven by larger AI server clusters and surging accelerator bandwidth needs. Growth is shifting from backend switches and optical modules toward accelerator high‑speed interconnects and NICs; chip‑platform shipment mix and network topology will shape overall market size and supply‑chain value allocation. Chip‑to‑chip high‑speed i

TrendForce’s AI Infra research forecasts the global AI Networking & Interconnect market will expand from $37.9 bln in 2024 to $279.8 bln in 2027, a 2024–27 CAGR of 95%, driven by larger AI server clusters and surging accelerator bandwidth needs. Growth is shifting from backend switches and optical modules toward accelerator high‑speed interconnects and NICs; chip‑platform shipment mix and network topology will shape overall market size and supply‑chain value allocation. Chip‑to‑chip high‑speed interconnect (Scale‑up) is projected to grow fastest: as GPU platforms move to rack‑level architectures and interconnects migrate off server motherboards to independent switch trays, demand for switch equipment and copper cabling should rise. Based on AI cluster deployment assumptions, TrendForce estimates Scale‑up’s share of AI network value will increase from 11% in 2024 to 24% in 2027.