TrendForce’s AI Infra research forecasts the global AI Networking & Interconnect
market will expand from $37.9 bln in 2024 to $279.8 bln in 2027, a 2024–27 CAGR
of 95%, driven by larger AI server clusters and surging accelerator bandwidth
needs. Growth is shifting from backend switches and optical modules toward
accelerator high‑speed interconnects and NICs; chip‑platform shipment mix and
network topology will shape overall market size and supply‑chain value
allocation. Chip‑to‑chip high‑speed interconnect (Scale‑up) is projected to grow
fastest: as GPU platforms move to rack‑level architectures and interconnects
migrate off server motherboards to independent switch trays, demand for switch
equipment and copper cabling should rise. Based on AI cluster deployment
assumptions, TrendForce estimates Scale‑up’s share of AI network value will
increase from 11% in 2024 to 24% in 2027.
