AMEC said PECVD and CuBS PVD are its highest-value thin-film deposition products. Its PECVD system uses 16 reaction stations and a new plasma source, delivering roughly 80–100% higher deposition throughput versus domestic and foreign standard equipment; PECVD nitride-oxide stacks and carbon hard-mask products are in successful client validation. Its CuBS PVD features 14 reaction chambers and a symmetric dual-path design, materially lowering BS-layer resistivity and boosting output by about 50–10

AMEC said PECVD and CuBS PVD are its highest-value thin-film deposition products. Its PECVD system uses 16 reaction stations and a new plasma source, delivering roughly 80–100% higher deposition throughput versus domestic and foreign standard equipment; PECVD nitride-oxide stacks and carbon hard-mask products are in successful client validation. Its CuBS PVD features 14 reaction chambers and a symmetric dual-path design, materially lowering BS-layer resistivity and boosting output by about 50–100%; multiple leading customers have approved the tool and units have been delivered to domestic advanced-logic R&D lines for validation. EPI remains critical for advanced logic: AMEC’s reduced-pressure epitaxy tools have been shipped to an advanced-process client for production validation, and its atmospheric-pressure epitaxy tools are entering wafer validation.