AMEC said PECVD and CuBS PVD are its highest-value thin-film deposition
products. Its PECVD system uses 16 reaction stations and a new plasma source,
delivering roughly 80–100% higher deposition throughput versus domestic and
foreign standard equipment; PECVD nitride-oxide stacks and carbon hard-mask
products are in successful client validation. Its CuBS PVD features 14 reaction
chambers and a symmetric dual-path design, materially lowering BS-layer
resistivity and boosting output by about 50–100%; multiple leading customers
have approved the tool and units have been delivered to domestic advanced-logic
R&D lines for validation. EPI remains critical for advanced logic: AMEC’s
reduced-pressure epitaxy tools have been shipped to an advanced-process client
for production validation, and its atmospheric-pressure epitaxy tools are
entering wafer validation.
