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1. 伊以冲突下中美国债利差走阔，中资美元债迎补涨机会。 2. 熊猫债迎“开门红”：外资竞相入局，一季度募资创单季新高。 3. 浙江省拟发行457.76亿元地方债，用于项目建设及偿还旧债。 4. 中小银行理财2026年末或不需“清零”，母行资质成理财子能否获批关键。 5. 债券通北向通2月成交8055亿元。 6. 财政部拟第一次续发行2026年记账式附息（四期）国债。 7. 债券通北向通2月成交8055亿元。 8. 汇丰控股拟发行合计25亿美元永久后偿或有可转换证券。 9. 洛阳古都发展集团拟发行3亿元公司债，招标主承销商。 10. 濮阳盛基控股集团拟发行7.5亿元公司债，获上交所受理。

1. 伊以冲突下中美国债利差走阔，中资美元债迎补涨机会。 2. 熊猫债迎“开门红”：外资竞相入局，一季度募资创单季新高。 3. 浙江省拟发行457.76亿元地方债，用于项目建设及偿还旧债。 4. 中小银行理财2026年末或不需“清零”，母行资质成理财子能否获批关键。 5. 债券通北向通2月成交8055亿元。 6. 财政部拟第一次续发行2026年记账式附息（四期）国债。 7. 债券通北向通2月成交8055亿元。 8. 汇丰控股拟发行合计25亿美元永久后偿或有可转换证券。 9. 洛阳古都发展集团拟发行3亿元公司债，招标主承销商。 10. 濮阳盛基控股集团拟发行7.5亿元公司债，获上交所受理。

2026-03-18

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agre

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agreement was signed by AMD CEO Lisa Su and Samsung co-CEO Jun Young-hyun in Pyeongtaek, South Korea.