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2026-03-18

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2026-03-18

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REPORTS IN ISRAEL: ‘THE IRANIAN INTELLIGENCE MINISTER WAS TARGETED LAST NIGHT.’

2026-03-18

1. 伊以衝突下中美國債利差走闊，中資美元債迎補漲機會。 2. 熊貓債迎“開門紅”：外資競相入局，一季度募資創單季新高。 3. 浙江省擬發行457.76億元地方債，用於項目建設及償還舊債。 4. 中小銀行理財2026年末或不需“清零”，母行資質成理財子能否獲批關鍵。 5. 債券通北向通2月成交8055億元。 6. 財政部擬第一次續發行2026年記賬式附息（四期）國債。 7. 債券通北向通2月成交8055億元。 8. 匯豐控股擬發行合計25億美元永久後償或有可轉換證券。 9. 洛陽古都發展集團擬發行3億元公司債，招標主承銷商。 10. 濮陽盛基控股集團擬發行7.5億元公司債，獲上交所受理。

1. 伊以衝突下中美國債利差走闊，中資美元債迎補漲機會。 2. 熊貓債迎“開門紅”：外資競相入局，一季度募資創單季新高。 3. 浙江省擬發行457.76億元地方債，用於項目建設及償還舊債。 4. 中小銀行理財2026年末或不需“清零”，母行資質成理財子能否獲批關鍵。 5. 債券通北向通2月成交8055億元。 6. 財政部擬第一次續發行2026年記賬式附息（四期）國債。 7. 債券通北向通2月成交8055億元。 8. 匯豐控股擬發行合計25億美元永久後償或有可轉換證券。 9. 洛陽古都發展集團擬發行3億元公司債，招標主承銷商。 10. 濮陽盛基控股集團擬發行7.5億元公司債，獲上交所受理。

2026-03-18

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agre

Samsung Electronics has reached a preliminary agreement with Advanced Micro Devices (AMD) to collaborate on next-generation AI memory and computing technologies. Under the deal, Samsung will supply HBM4 high-bandwidth memory for AMD’s MI455X accelerators used in corporate data centers. Additionally, Samsung will provide DDR5 memory chips for AMD’s Helios system, based on the MI455X and new Venice CPU design. The companies also plan to explore potential foundry partnership opportunities. The agreement was signed by AMD CEO Lisa Su and Samsung co-CEO Jun Young-hyun in Pyeongtaek, South Korea.